HP ProLiant DL80 G9 Bedienungsanleitung
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HPE ProLiant DL80 Gen9 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware
components and software. This guide is for an experienced
service technician. Hewlett Packard Enterprise assumes that you are qualified
in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 785385- 003
April 2016
Edition: 4
© Copyright 2014, 2016 Hewlett Packard Enterprise Development LP
The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services
are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting
an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.
Intel® and Xeon® are trademarks of Intel Corporation in the U.S. and other countries.
Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.
Microsoft® and Windows® are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.
microSD is a trademark or a registered trademark of SD-3C in the United States, other countries or both.
Contents 3
Contents
Customer self repair.................................................................................................................................. 6
Parts only warranty service ...................................................................................................................................... 6
Illustrated parts catalog ........................................................................................................................... 16
Mechanical components ......................................................................................................................................... 16
System components ............................................................................................................................................... 18
Removal and replacement procedures ................................................................................................... 24
Required tools ........................................................................................................................................................ 24
Safety considerations ............................................................................................................................................. 24
Preventing electrostatic discharge............................................................................................................... 24
Symbols on equipment ................................................................................................................................ 24
Server warnings and cautions ..................................................................................................................... 25
Rack warnings ............................................................................................................................................. 25
Preparation procedures .......................................................................................................................................... 26
Remove the security bezel (optional) .......................................................................................................... 27
Power down the server ................................................................................................................................ 27
Extend the server from the rack .................................................................................................................. 27
Access the product rear panel ..................................................................................................................... 30
Remove the server from the rack ................................................................................................................ 30
Remove the PCI riser cages........................................................................................................................ 31
Non- - hot plug drive carrier....................................................................................................................................... 32
Non- - hot plug drive.................................................................................................................................................. 33
Hot- plug drive blank ............................................................................................................................................... 34
Hot- plug drive ......................................................................................................................................................... 34
Access panel .......................................................................................................................................................... 35
Air baffle ................................................................................................................................................................. 36
4- - - bay LFF non hot plug drive backplane................................................................................................................ 37
4- - bay LFF hot plug drive backplane....................................................................................................................... 38
Smart Storage Battery ............................................................................................................................................ 39
Smart Storage Battery retainer ............................................................................................................................... 40
FBWC module ........................................................................................................................................................ 41
M.2 SSD enablement kit ......................................................................................................................................... 42
Fan blank ................................................................................................................................................................ 44
Hot- swap fan .......................................................................................................................................................... 45
DIMMs .................................................................................................................................................................... 46
Memory- processor compatibility information............................................................................................... 46
Removing the DIMM .................................................................................................................................... 46
Processor blank ...................................................................................................................................................... 47
Heatsink ................................................................................................................................................................ . 48
Processor ............................................................................................................................................................... 50
Expansion board .................................................................................................................................................... 54
Primary PCI riser cage blank .................................................................................................................................. 56
Onboard low profile PCI expansion slot cover- ....................................................................................................... 58
Primary PCI riser cage ........................................................................................................................................... 58
FlexibleLOM riser cage .......................................................................................................................................... 59
GPU riser board ..................................................................................................................................................... 59
Two- slot PCIe riser board....................................................................................................................................... 60
FlexibleLOM riser board ......................................................................................................................................... 61
System battery ....................................................................................................................................................... 62
Front I/O assembly ................................................................................................................................................. 63
Thumbscrew rack ears ........................................................................................................................................... 65
Quick ..................................................................................................................- release latch rack ear assembly 66
System board ......................................................................................................................................................... 69
HPE 550 W Power Supply ..................................................................................................................................... 76
Produktspezifikationen
| Marke: | HP |
| Kategorie: | Server |
| Modell: | ProLiant DL80 G9 |
| Installiertes Betriebssystem: | Nein |
| Prozessorhersteller: | Intel |
| Anzahl Prozessorkerne: | 6 |
| Breite: | 434.7 mm |
| Tiefe: | 634.3 mm |
| Gewicht: | 27000 g |
| Höhe: | 87.6 mm |
| Anzahl USB 2.0 Anschlüsse: | 1 |
| Anzahl Ethernet-LAN-Anschlüsse (RJ-45): | 2 |
| Stromversorgung: | 550 W |
| Intel® Wireless-Display (Intel® WiDi): | Nein |
| Grafikkarte: | G200eH2 |
| Prozessor-Taktfrequenz: | 1.9 GHz |
| Prozessorfamilie: | Intel® Xeon® E5 v3 |
| Prozessor: | E5-2609V3 |
| Speicherkapazität: | 8 GB |
| USB 3.2 Gen 1 (3.1 Gen 1) Anzahl der Anschlüsse vom Typ A: | 2 |
| Gehäusetyp: | Rack (2U) |
| Prozessor-Cache: | 15 MB |
| Konfliktloser-Prozessor: | Nein |
| Frontsidebus des Prozessors: | - MHz |
| Prozessor Cache Typ: | Smart Cache |
| Prozessor Codename: | Haswell |
| Prozessor Lithografie: | 22 nm |
| Prozessorbetriebsmodi: | 64-Bit |
| Prozessor-Paketgröße: | 52.5 x 45 mm |
| Prozessor-Threads: | 6 |
| Stepping: | M1 |
| Systembus-Rate: | 6.4 GT/s |
| Thermal Design Power (TDP): | 85 W |
| Prozessor-Serien: | Intel Xeon E5-2600 v3 |
| Intel® Virtualisierungstechnik (Intel® VT): | VT-d, VT-x |
| Prozessorsockel: | LGA 2011-v3 |
| ARK Prozessorerkennung: | 81897 |
| Interner Speichertyp: | DDR4-SDRAM |
| Intel® Turbo-Boost-Technologie: | Nein |
| Eingebettete Optionen verfügbar: | Ja |
| Intel® 64: | Ja |
| Intel® Virtualization Technologie (VT-X): | Ja |
| Anzahl VGA (D-Sub) Anschlüsse: | 1 |
| Motherboard Chipsatz: | Intel C610 |
| RAM-Speicher maximal: | 128 GB |
| Ethernet Schnittstellen Typ: | Gigabit Ethernet |
| HDD Größe: | - " |
| Gesamtspeicherkapazität: | 0 GB |
| Intel® Hyper-Threading-Technik (Intel® HT Technology): | Nein |
| Intel® Identity-Protection-Technologie (Intel® IPT): | Nein |
| Verbesserte Intel SpeedStep Technologie: | Ja |
| Anzahl installierter Prozessoren: | 1 |
| PCI-Express-Slots-Version: | 3.0 |
| PCI Express Konfigurationen: | x4, x8, x16 |
| Maximale Anzahl der PCI-Express-Lanes: | 40 |
| Maximaler interner Speicher, vom Prozessor unterstützt: | 768 GB |
| Speichertypen, vom Prozessor unterstützt: | DDR4-SDRAM |
| Speichertaktraten, vom Prozessor unterstützt: | 1600,1866,2133 MHz |
| Durch den Prozessor (max) unterstützte Speicherbandbreite: | 51 GB/s |
| Speichertaktfrequenz: | 2133 MHz |
| Speicherkartensteckplätze: | 8x DIMM |
| Speicherlayout: | 1 x 8 GB |
| Optisches Laufwerk - Typ: | Nein |
| Unterstützte Befehlssätze: | AVX 2.0 |
| Intel® Quick-Sync-Video-Technik: | Nein |
| Intel® InTru™ 3D Technologie: | Nein |
| Intel® Clear Video HD Technology für (Intel® CVT HD): | Nein |
| Intel® AES New Instructions (Intel® AES-NI): | Ja |
| Execute Disable Bit: | Ja |
| Leerlauf Zustände: | Ja |
| Thermal-Überwachungstechnologien: | Ja |
| Intel® Trusted-Execution-Technik: | Ja |
| Skalierbarkeit: | 2S |
| CPU Konfiguration (max): | 2 |
| Intel® VT-x mit Extended Page Tables (EPT): | Ja |
| Intel® TSX-NI: | Nein |
| Intel® Sicherer Schlüssel: | Ja |
| Intel® OS Guard: | Ja |
| Intel® Virtualisierungstechnik für direkte I/O (VT-d): | Ja |
| Intel® Clear Video Technologie: | Nein |
| Grafikkarte-Familie: | Matrox |
| Bus Typ: | QPI |
| Speicherkanäle, vom Prozessor unterstützt: | Quad |
| ECC vom Prozessor unterstützt: | Ja |
| FSB Gleichwertigkeit: | Nein |
| Intel® My-WiFi-Technik (Intel® MWT): | Nein |
| Intel® Anti-Theft Technologie (Intel® AT): | Nein |
| Intel® Insider™: | Nein |
| Intel® Flex Memory Access: | Nein |
| Intel® Smart Cache: | Ja |
| Intel® Enhanced Halt State: | Ja |
| Intel® Demand Based Switching: | Ja |
| Intel® Clear Video Technology für Mobile Internet Devices (Intel® CVT for MID): | Nein |
| Intel® Identity Protection Technologieversion: | 0.00 |
| Intel® Secure Key Technologieversion: | 1.00 |
| Intel® TSX-NI-Version: | 0.00 |
| Intel® Dual Display Capable Technology: | Nein |
| Intel® FDI-Technik: | Nein |
| Intel® Rapid-Storage-Technik: | Nein |
| Intel® Fast Memory Access: | Nein |
| Tcase: | 70.9 °C |
| Physical Address Extension (PAE): | Ja |
| Anzahl der Haupt-Netzteile: | 1 |
| Anzahl der QPI links: | 2 |
| Max. Speicherkapazität: | - TB |
| Ungenutzter Lüfter-Support: | Ja |
| Ethernet/LAN: | Ja |
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