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SAMA5D2 SIP

SAMA5D2 System in Package (SIP) MPU with up to 1 Gbit

DDR2 SDRAM or 2 Gbit LPDDR2 SDRAM

Scope

This document is an overview of the main features of the SAMA5D2 SIP. The sole reference documents for product

information on the SAMA5D2 and the LPDDR2/DDR2-SDRAM memories are listed in the table below.

Introduction

The SAMA5D2 System-In-Package (SIP) integrates the Arm

® Cortex®-A5 processor-based SAMA5D2 MPU with up

to 1 Gbit DDR2-SDRAM or up to 2 Gbit LPDDR2-SDRAM in a single package.

By combining the high-performance, ultra-low power SAMA5D2 with LPDDR2/DDR2-SDRAM in a single package,

PCB routing complexity, area and number of layers is reduced in the majority of cases. This makes board design

easier and more robust by facilitating design for EMI, ESD and signal integrity.

DDR2-SDRAM memory sizes and package options available

• 128 Mbit, TFBGA196

• 512 Mbit and 1 Gbit, TFBGA289

LPDDR2-SDRAM memory sizes and package options available

• 1 Gbit and 2 Gbit, TFBGA361

While the smallest option targets applications with a small OS or bare metal, the larger options are suitable for

applications using Linux®.

Reference Documents

Type Document Title Available Ref. No.

Data sheet SAMA5D2 Series www.microchip.com DS60001476

Data sheet 2 Mwords × 4 Banks × 16 bits

DDR2 SDRAM (128 Mbit) www.winbond.com W9712G6KB25I

Data sheet 8 Mwords × 4 Banks × 16 bits

DDR2 SDRAM (512 Mbit) www.winbond.com W9751G6KB25I

Data sheet 8 Mwords × 8 Banks × 16 bits

DDR2 SDRAM (1 Gbit) www.winbond.com W971GG6SB25I

Data sheet 4 Mwords × 8 Banks × 32 bits

LPDDR2-SDRAM (1 Gbit) www.apmemory.com AD210032F-I-AB

Data sheet 8 Mwords × 8 Banks × 32 bits

LPDDR2-SDRAM (2 Gbit) www.apmemory.com AD220032D-I-ED/PC/AB

Table of Contents

Scope............................................................................................................................................................. 1

Introduction.....................................................................................................................................................1

Reference Documents....................................................................................................................................1

1. Features.................................................................................................................................................. 4

2. DDR2-SDRAM Features......................................................................................................................... 7

3. LPDDR2-SDRAM Features.....................................................................................................................8

4. Configuration Summary.......................................................................................................................... 9

5. Chip Identifier........................................................................................................................................ 10

6. Package and Ballout..............................................................................................................................11

7. Memory................................................................................................................................................. 39

8. Electrical Characteristics.......................................................................................................................40

8.1. Recommended Thermal Operating Conditions.......................................................................... 40

8.2. Decoupling................................................................................................................................. 40

8.3. Power Sequences...................................................................................................................... 40

9. Mechanical Characteristics................................................................................................................... 45

9.1. 361-ball TFBGA..........................................................................................................................45

9.2. 289-ball TFBGA..........................................................................................................................48

9.3. 196-ball TFBGA..........................................................................................................................49

10. Ordering Information............................................................................................................................. 50

11. Revision History.................................................................................................................................... 51

11.1. DS60001484D - 03/2021............................................................................................................51

11.2. DS60001484C - 01/2020............................................................................................................51

11.3. DS60001484B - 11/2018............................................................................................................ 51

11.4. DS60001484A - 09/2017............................................................................................................51

The Microchip Website.................................................................................................................................52

Product Change Notification Service............................................................................................................52

Customer Support........................................................................................................................................ 52

Product Identification System.......................................................................................................................53

Microchip Devices Code Protection Feature................................................................................................ 53

Legal Notice................................................................................................................................................. 54

Trademarks.................................................................................................................................................. 54

Quality Management System....................................................................................................................... 55

SAMA5D2 SIP