Microchip DOC206379 Bedienungsanleitung

Microchip Nicht kategorisiert DOC206379

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Product Specication

DS00005882A - 1

General

Rev Cage Code

F 00136

This specication denes the design, assembly, and functional evaluation of high reliability, Space qualied,

hybrid clock oscillators produced by Microchip. Devices delivered to this specication represent the

standardized Parts, Materials and Processes (PMP) Program developed, implemented, and certied for

advanced applications and extended environments.

For more information see www.microchip.com/en-us/products/clock-and-timing/components/oscillators/space.

Applicaons Overview

The designs represented by these products were primarily developed for the MIL-Aerospace community. The

lesser Design Pedigrees and Screening Options imbedded within DOC206379 bridge the gap between Space

and COTS hardware by providing custom hardware with measures of mechanical, assembly, and reliability

assurance needed for Military or Ruggedized COTS environments.

DOC206379

300 krad(Si) Tolerant CMOS Hybrid Clock Oscillator

Hi-Rel Standard

Product Specication

DS00005882A - 2

Table of Contents

General...................................................................................................................................................................................1

Applications Overview..........................................................................................................................................................1

1. Applicable Documents..................................................................................................................................................3

1.1. Specications and Standards........................................................................................................................... 3

2. General Requirements..................................................................................................................................................4

2.1. Classication.......................................................................................................................................................4

2.2. Item Identication..............................................................................................................................................4

2.3. Absolute Maximum Ratings..............................................................................................................................4

2.4. Design, Parts, Materials and Processes, Assembly, Inspection and Test....................................................4

3. Detail Requirements..................................................................................................................................................... 6

3.1. Components....................................................................................................................................................... 6

3.2. Mechanical.......................................................................................................................................................... 7

3.3. Electrical.............................................................................................................................................................. 7

4. Quality Assurance Provisions and Verication.......................................................................................................... 9

4.1. Verication and Test.......................................................................................................................................... 9

4.2. Optional Design, Test, and Data Parameters............................................................................................... 10

4.3. Test Conditions................................................................................................................................................ 11

4.4. Deliverable Data...............................................................................................................................................11

4.5. Discrepant Material......................................................................................................................................... 11

4.6. Failure Analysis.................................................................................................................................................11

5. Preparation for Delivery............................................................................................................................................. 12

5.1. Packaging.......................................................................................................................................................... 12

6. Ordering Information................................................................................................................................................. 13

6.1. Ordering Part Number.................................................................................................................................... 13

6.2. Optional Design, Test, and Data Parameters............................................................................................... 15

7. Appendix...................................................................................................................................................................... 20

7.1. Recommended Land Pattern......................................................................................................................... 20

Microchip Information....................................................................................................................................................... 21

Trademarks.................................................................................................................................................................. 21

Legal Notice..................................................................................................................................................................21

Microchip Devices Code Protection Feature............................................................................................................21