Samsung M471A5244CB0-CWE Bedienungsanleitung

Samsung Nicht kategorisiert M471A5244CB0-CWE

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Module

Handling

Guide

How to handle the module

Recently module failure related with Active/Passive/Component crack has increased.

Main root causes are wrong handling method and mechanical damage.

Current products have more cap. & resistors and the sizes of those passives are reduced and most of them are located around edge

area.

These characteristics require more cautious module handling method.

This guide book tries to nd out tendency and range of module crack pattern based on experiments from several aspects. The main

purpose is to reinforce Samsung’s process control and help customer effectively control module handling process.

Test methods are PCB Bow, Twist, Drop Test, UTM(Universal Testing Machine) Test for DRAM, Resister & Capacitor. We observed

crack phenomena and tendency through the datum and pictures. Tested products are limited to Registered DIMM [RDIMM],

Unbuffered DIMM [UDIMM] and BOC PKG based Module, therefore test results might be different when applied to other products.

Overview

Memory Module Introduction

Unbuffered DIMM

Registered DIMM

Load Reduced DIMM

SODIMM

Proper Handling

• Modules should be picked up from packing

trays only one-by-one.

• Product should be handled at the

conductive mat.

• Do not grab packages. Hold only the edge

of the PCB with both hands.

• Wear gloves when handling.

• Tray must be covered when handling

module tray.

• Anti-ESD* straps should be used.

• The strap should be linked to your body.

*ESD : Electro Static Discharge

Produktspezifikationen

Marke:	Samsung
Kategorie:	Nicht kategorisiert
Modell:	M471A5244CB0-CWE
RAM-Speicher:	4 GB
Interner Speichertyp:	DDR4
Komponente für:	Notebook
ECC:	Ja
Speichertaktfrequenz:	3200 MHz
Memory Formfaktor:	260-pin SO-DIMM
Speicherspannung:	1.2 V
Speicherlayout (Module x Größe):	1 x 4 GB
Modulkonfiguration:	512M x 16