Texas Instruments FDC2212-Q1 Bedienungsanleitung

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FDC2x1x-Q1 Multi-Channel, High Resolution Capacitance-to-Digital Converter for

Capacitive Sensing Applications

1 Features

•Qualified for automotive applications

•AEC-Q100 qualified with the following results:

–Device temperature grade 1: –40°C to +125°C

ambient operating temperature range

–Device HBM ESD classification level 2

–Device CDM ESD classification level C5

•EMI-resistant architecture

•Maximum output rates (one active channel):

–13.3kSPS (FDC2112-Q1, FDC2114-Q1)

–4.08kSPS (FDC2212-Q1, FDC2214-Q1)

•Maximum input capacitance: 250nF (at 10kHz with

1mH inductor)

•Sensor excitation frequency: 10kHz to 10MHz

•Number of channels: 2, 4

•Resolution: up to 28 bits

•RMS noise: 0.3fF at 100SPS and f

SENSOR

= 5MHz

•Supply voltage: 2.7V to 3.6V

•power consumption: active: 2.1mA

•Low-power sleep mode: 35µA

•Shutdown: 200nA

•Interface: I

2

C

•Temperature range: –40°C to +125°C

2 Applications

•Proximity sensor

•Gesture recognition

•Automotive door / kick sensors

•Level sensor for conductive liquids

3 Description

Capacitive sensing is a low-power, high-resolution

contactless sensing technique that can be applied

to a variety of applications ranging from proximity

detection to gesture recognition. The sensor in a

capacitive sensing system is any metal or conductor,

allowing for highly flexible system design.

The main challenge limiting sensitivity in capacitive

sensing applications is noise susceptibility of the

sensors. With the FDC2x1x-Q1 resonant sensing

architecture, performance can be maintained even in

presence of fluorescent light.

The FDC2x1x-Q1 is a multi-channel family of

high-resolution, high-speed capacitance-to-digital

converters for implementing capacitive sensing

solutions. The devices employ an innovative narrow-

band based architecture to offer high rejection of

noise while providing high resolution at high speed.

The devices support a wide excitation frequency

range, offering flexibility in system design.

Package Information

PART NUMBERPACKAGE

(1)

PACKAGE SIZE

(2)

FDC2112-Q1DNT (WSON, 12)4mm × 4mm

FDC2114-Q1RGH (WQFN, 16)4mm × 4mm

FDC2212-Q1DNT (WSON, 12)4mm × 4mm

FDC2214-Q1RGH (WQFN, 16)4mm × 4mm

(1)For all available packages, see the orderable addendum at

the end of the data sheet.

(2)The package size (length × width) is a nominal value and

includes pins, where applicable.

IN0A

IN0B

IN3A

IN3B

FDC2114 / FDC2214

VDD

GND

SCL

SDA

Int. Osc.

ADDR

INTB

SD

GND

MCU

VDD

3.3 V

3.3 V

GPIO

GPIO

0.1 F1 F

Core

Resonant

circuit driver

Resonant

circuit driver

I

2

C

I

2

C

peripheral

3.3 V

L

Cap Sensor 0

CLKIN

40 MHz

L

Cap Sensor 3

Copyright © 2016, Texas Instruments Incorporated

Simplified Schematic

FDC2112-Q1, FDC2114-Q1, FDC2212-Q1, FDC2214-Q1

SNOSCZ9A – MAY 2016 – REVISED OCTOBER 2024

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

Produktspezifikationen