Texas Instruments SN74LVTH16541DL Bedienungsanleitung

Texas Instruments Nicht kategorisiert SN74LVTH16541DL

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FEATURES

SN54LVTH16541 . . . WD PACKAGE

SN74LVTH16541 . . . DGG OR DL PACKAGE

(TOP VIEW)

1OE1

1Y1

1Y2

GND

1Y3

1Y4

VCC

1Y5

1Y6

GND

1Y7

1Y8

2Y1

2Y2

GND

2Y3

2Y4

VCC

2Y5

2Y6

GND

2Y7

2Y8

2OE1

1OE2

1A1

1A2

GND

1A3

1A4

VCC

1A5

1A6

GND

1A7

1A8

2A1

2A2

GND

2A3

2A4

VCC

2A5

2A6

GND

2A7

2A8

2OE2

DESCRIPTION/ORDERING INFORMATION

SN54LVTH16541

3.3-V ABT 16-BIT

WITH 3-STATE

SCBS691E – MAY 1997 –

•Members of the Texas Instruments Widebus™

Family

•State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V Operation

and Low Static-Power Dissipation

•Support Mixed-Mode Signal Operation

(5-V Input and Output Voltages With

3.3-V V

CC)

•Support Unregulated Battery Operation

to 2.7 V

•Typical V

OLP (Output Ground Bounce) <0.8 V

at V

CC = 3.3 V, T

A= 25 C°

•I

o and Power-Up 3-State Support Hot

Insertion

•Bus Hold on Data Inputs Eliminates the N

for External Pullup/Pulldown Resistors

•Distributed V

CC and GND Pin Conguration

Minimizes High-Speed Switching Noise

•Flow-Through Architecture Optimizes P

Layout

•Latch-Up Performance Exceeds 500 mA

JESD 17

•ESD Protection Exceeds 2000 V Per

MIL-STD-883, Method 3015; Exceeds 200

Using Machine Model (C = 200 pF, R = 0)

•Package Options Include Plastic Shrink

Small-Outline (DL) and Thin Shrink

Small-Outline (DGG) Packages and 380-mil

Fine-Pitch Ceramic Flat (WD) Package Usin

25-mil Center-to-Center Spacings

These 16-bit buers/drivers are designed spe

CC operation, but

capability to provide a TTL interface to a 5-V sy

These devices are noninverting 16-bit buers

signals. For either 8-bit buer section, the two

be low for the corresponding Y outputs to be a

buer section are in the high-impedance state.

When V

CC is between 0 and 1.5 V, the devices are in

However, to ensure the high-impedance state

CC through a pullup

the minimum value of the resistor is determined

Active bus-hold circuitry is provided to hold unu

These devices are fully specied for hot-insertion

o and power-up 3-state.

o circuitry

disables the outputs, preventing damaging cu

The power-up 3-state circuitry places the outputs

which prevents driver conict.

Please be aware that an important notice concerning

Instruments semiconductor products and disclaimers

Widebus is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

www.ti.com

DESCRIPTION/ORDERING INFORMATION

SN54LVTH16541 SN74LVTH16541, ,

3.3-V ABT 16-BIT BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCBS691E – MAY 1997 – REVISED NOVEMBER 2006

The SN54LVTH16541 is characterized for oper

The SN74LVTH16541 is characterized for oper

ORDERING INFORMATION

TAPACKAGE(1) ORDERABLE PART NUMBER

74LVTH16541DLRG4

Reel of 1000

SN74LVTH16541DLR

SSOP – DL LVTH16541

SN74LVTH16541DL

–40 C to 85 C Tube of 25° °

SN74LVTH16541DLG4

74LVTH16541DGGRE4

TSSOP – DGG Reel of 2000

SN74LVTH16541DGGR

(1) Package drawings, standard packing quantities, therma

www.ti.com/sc/package.

FUNCTION TABLE

(each 8-bit section)

INPUTS OUTPUT

OE1 OE2 A

L L L L

L L H H

H X X Z

X H X Z

2Submit Documentation Feedback

www.ti.com

LOGIC SYMBOL

(1)

1A1 1Y1

1A2 1Y2

1A3 1Y3

1A4 1Y4

1A5 1Y5

1A6 1Y6

1A7 1Y7

1A8 1Y8

2A1 2Y1

2A2 2Y2

2A3 2Y3

2A4 2Y4

2A5 2Y5

2A6 2Y6

2A7 2Y7

2A8 2Y8

1OE1

1OE2

2OE1

2OE2

EN1

EN2

LOGIC DIAGRAM (POSITIVE

1OE1

1OE2

2OE1

2OE2

1A1 1Y1 2Y12A1

To Seven Other Channels To Seven Other Channels

213

SN54LVTH16541 SN74LVTH16541, ,

3.3-V ABT 16-BIT BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCBS691E – MAY 1997 –

(1) This symbol is in accordance with ANSI/IEEE Std

Submit Documentation Feedback

Produktspezifikationen

Marke:	Texas Instruments
Kategorie:	Nicht kategorisiert
Modell:	SN74LVTH16541DL
Breite:	16 mm
Tiefe:	7.59 mm
Höhe:	2.59 mm
Betriebstemperatur:	-40 - 85 °C
Verpackungsbreite:	14.24 mm
Verpackungstiefe:	473.7 mm
Verpackungshöhe:	5.11 mm
Typ:	Logik-IC
Menge pro Packung:	25 Stück(e)
Verpackungsart:	SSOP
Temperaturbereich bei Lagerung:	-65 - 150 °C
Anzahl Pins:	48
Breite (mit Pins):	16 mm
Tiefe (mit Pins):	10.67 mm
Höhe (mit Pins):	2.79 mm