Huawei FusionServer X6800 Bedienungsanleitung

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HUAWEI X6800 Server

White Paper

Issue 04

Date 2017-07-26

HUAWEI TECHNOLOGIES CO., LTD.

No part of this document may be reproduced or transmitted in any form or by any means without prior written

consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective

holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the

customer. All or part of the products, services and features described in this document may not be within the

purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,

and recommendations in this document are provided "AS IS" without warranties, guarantees or

representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the

preparation of this document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base

Bantian, Longgang

Shenzhen 518129

People's Republic of China

Website: http://e.huawei.com

Issue 04 (2017-07-26) Huawei Proprietary and Confidential

Contents

1 Overview......................................................................................................................................... 1

1.1 Product Positioning.........................................................................................................................................................2

1.2 Features...........................................................................................................................................................................3

2 System Design................................................................................................................................5

2.1 Architecture Design........................................................................................................................................................6

2.2 Heat Dissipation............................................................................................................................................................. 7

2.3 Management and Monitoring......................................................................................................................................... 7

2.4 Advantages..................................................................................................................................................................... 8

3 Hardware Description.................................................................................................................. 9

3.1 Appearance................................................................................................................................................................... 10

3.2 Components.................................................................................................................................................................. 14

3.3 Server Node.................................................................................................................................................................. 15

3.4 PCIe.............................................................................................................................................................................. 17

3.5 Fan Module...................................................................................................................................................................18

3.6 PSU...............................................................................................................................................................................19

3.7 Backplane..................................................................................................................................................................... 22

3.8 System Management Board and Fan Switch Board..................................................................................................... 23

4 Security Management.................................................................................................................26

4.1 Compute Node..............................................................................................................................................................27

4.2 MM............................................................................................................................................................................... 27

5 Management................................................................................................................................. 28

5.1 iBMC Features..............................................................................................................................................................29

5.2 HMM Features..............................................................................................................................................................30

5.3 Management Principles................................................................................................................................................ 31

5.4 Management Modes..................................................................................................................................................... 32

6 Technical Specifications.............................................................................................................35

6.1 Chassis Specifications.................................................................................................................................................. 36

6.2 Node Specifications......................................................................................................................................................37

6.3 Power Supply and Power..............................................................................................................................................38

6.4 Environment Specifications..........................................................................................................................................40