Lenovo e x3550 M3 Bedienungsanleitung

Lenovo Server e x3550 M3

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Leadership enterprise server with significantly lower cost of ownership in a highly available and
expandable, rack-dense, 1U dual-socket server
Please see the Legal Information section for important notices and information. 1
Product Guide
February 2011
IBM System x3550 M3
Product Overview
CONTENTS
Product Overview
1
Selling Features
2
Key Features
4
Key Options 1
3
x3550 M3 Images 1
4
x3550 M3 Specifications 1
5
The Bottom Line 1
8
Server Comparison
20
For More Information 2
1
Legal Information 2
1
Outstanding innovation in only 1U
Suggested Uses: All sectors requiring highly available, energy-efficient, rack-optimized solution
for physical and virtual intensive commercial environments like eBusiness/eCommerce,
collaboration, virtualization, database, and enterprise resource planning applications.
Your challenge is to do more with less—serve more Web pages, handle more secure
connections, support more e-mail users. You need to reduce the costs of doing business and
improve the service you deliver to your customers while lowering your overall risk. The dual-
socket IBM® Systemx3550 M3 can reduce your costs with its new energy smart design. It can
improve service with reduced operational complexity and increased management functionality. It
will lower your IT risk with the resiliency that comes from no single point of failure. And like all
IBM servers, the x3550 M3 offers you the trust that comes from the IBM global reach, service and
support.
The x3550 M3 is a game-changing rack server that uses significantly less power than previous
generations, with unified systems management tools, leadership reliability, availability, and
serviceability features and broad systems flexibility, housed in a compact 1U mechanical
package.
The x3550 M3 features Intel® Xeon® 5600 6-core 4-core seriesandprocessors, with up to
12MB L3 cacheof shared, to provide you with the computing power you need to match your
business needs and growth. The new line of Intel processors delivers unprecedented intelligent
performance with features like adaptive performance for applications and environments, Turbo
Boost Technology and Hyper-Threading Technology, and integrated power gates and automated
power management.
The x3550 M3 supports up to / of (RDIMM) 18 DIMMs192GBregistered1333MHz DDR3
memory (or up to DIMMs / of unbuffered UDIMM memory) and provides 12 48GBChipkill
ECC
(Error Checking and Correcting) protection—for high performance and reliability. For even higher
levels of availability, the x3550 M3 also offers . Up to integrated high-speed memory mirroring4
Gigabit Ethernet ports are available (offering (TCP Offload Engine) support on MicrosoftTOE ®
Windows®), as are two high-performance adapter slots (). The x3650 M3 offers an PCIe x16
optional to manage your virtual workloads. embedded hypervisor
The x3550 M3 offers a choice of up to supports up to high-performance hot-swap HDDs with an 8
internal storage capacity of 8TB1 ( or 2.5-inch hot-swap Serial-Attached SCSI(SAS) Serial-
Attached ATA (SATA)8 solid-state drives (SSDs) drives). Alternatively, up to are also
available to keep power low, improve resiliency, and offer up to of storage. The server 400GB
includes a choice of several IBM ServeRAID® storage controllers that provide broad levels of
hardware-based . The ultradense form factor allows businesses to increase RAID solutions1U
their computing power and spread their workload without outgrowing their current data center. Up
to of these servers can be installed in a single 42U rack, for a total of up to processors 42 1U84
and processor cores, offering tremendous deployment flexibility. 504
Standard in the x3550 M3 is the Integrated Management Module (IMM) that enables the user to
manage and control the server easily—both locally and remotely. In conjunction with the IMM, the
x3550 M3 comes with an () that based on altitude sensor altimetergoverns fan rotation
altitude, to help lower your energy consumption. The IMM offers a high level of manageability that
is designed to keep costs down and the system up—even when network usage increases. IBM’s
innovative pop-out/drop-down panel enables quick servicing of the light path diagnostics
system if a problem develops. These advanced features help maximize network availability by
increasing uptime, as do hot ; or simple-swap solid-state drives hot-swap/redundant SAS
SATA , redundant ultra-efficient and ; HDDspower suppliesfan modulesActive Memory
;
integrated ; withRAIDtemperature-controlled fans Calibrated Vectored Cooling
; IPMI 2.0
support, including and; as well as highly secure remote power control Serial over LANtext-
console redirect over LAN.
1 1TB drives available in 2Q/2011.
®

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Produktspezifikationen

Marke: Lenovo
Kategorie: Server
Modell: e x3550 M3
Prozessorhersteller: Intel
Anzahl Prozessorkerne: 6
Breite: 440 mm
Tiefe: 711.4 mm
Gewicht: 15900 g
Höhe: 43 mm
Anzahl USB 2.0 Anschlüsse: 4
Betriebstemperatur: 10 - 32 °C
Eingebauter Ethernet-Anschluss: Ja
Anzahl Ethernet-LAN-Anschlüsse (RJ-45): 2
Stromversorgung: 675 W
Mac-Kompatibilität: Nein
Intel® Wireless-Display (Intel® WiDi): Nein
Netzteiltyp: AC/DC
Grafikkarte: G200eV
Prozessor-Taktfrequenz: 2.66 GHz
Prozessorfamilie: Intel® Xeon® 5000er-Prozessoren
Prozessor: X5650
Kompatible Betriebssysteme: Windows Server 2008, 2008 R2 (32/64-bit)\nMicrosoft Windows Server 2003, 2003 R2 (32/64-bit)\nRHEL 5 (32/64-bit)\nRHEL 6 (32/64-bit)\nSLES 10/11 (32/64-bit)\nVMware vSphere Hypervisor 4.1\nSun Solaris 10
RAID-Unterstützung: Ja
RAID Level: 10
RAM-Speicher: 4 GB
Gehäusetyp: Rack (1U)
Prozessor-Cache: 12 MB
Prozessor Boost-Frequenz: 3.06 GHz
Konfliktloser-Prozessor: Nein
Frontsidebus des Prozessors: - MHz
Prozessor Cache Typ: Smart Cache
Prozessor-Code: SLBV3
Prozessor Codename: Westmere EP
Prozessor Lithografie: 32 nm
Prozessorbetriebsmodi: 64-Bit
Prozessor-Paketgröße: 42.5 X 45 mm
Prozessor-Threads: 12
Stepping: B1
Systembus-Rate: 6.4 GT/s
Thermal Design Power (TDP): 95 W
Prozessor-Serien: Intel Xeon 5600 Series
Prozessorsockel: Socket B (LGA 1366)
ARK Prozessorerkennung: 47922
Interner Speichertyp: DDR3-SDRAM
Intel® Turbo-Boost-Technologie: 1.0
Eingebettete Optionen verfügbar: Nein
Intel® 64: Ja
Intel® Virtualization Technologie (VT-X): Ja
Anzahl VGA (D-Sub) Anschlüsse: 1
Kompatible Prozessoren: Intel® Xeon®
Maximale Anzahl an SMP-Prozessoren: 2
Motherboard Chipsatz: Intel® 5520
ECC: Ja
RAM-Speicher maximal: 192 GB
Maximaler Grafikkartenspeicher: 16 MB
LAN-Controller: Broadcom BCM5709S
Nachhaltigkeitszertifikate: ENERGY STAR
Anzahl serielle Anschlüsse: 1
HDD Größe: 2.5 Zoll
Gesamtspeicherkapazität: 0 GB
Höhe bei Betrieb: 914.4 - 2133 m
Intel® Hyper-Threading-Technik (Intel® HT Technology): Ja
Verbesserte Intel SpeedStep Technologie: Ja
Anzahl installierter Prozessoren: 1
Maximaler interner Speicher, vom Prozessor unterstützt: 288 GB
Speichertypen, vom Prozessor unterstützt: DDR3-SDRAM
Speichertaktraten, vom Prozessor unterstützt: 800,1066,1333 MHz
Durch den Prozessor (max) unterstützte Speicherbandbreite: 32 GB/s
Speichertaktfrequenz: 1066 MHz
Speicherkartensteckplätze: 18x DIMM
Speicherlayout: 1 x 4 GB
Optisches Laufwerk - Typ: Nein
Unterstützte Befehlssätze: SSE4.2
Intel® Quick-Sync-Video-Technik: Nein
Intel® InTru™ 3D Technologie: Nein
Intel® Clear Video HD Technology für (Intel® CVT HD): Nein
Intel® AES New Instructions (Intel® AES-NI): Ja
Execute Disable Bit: Ja
Leerlauf Zustände: Ja
Thermal-Überwachungstechnologien: Nein
Intel® Trusted-Execution-Technik: Ja
CPU Konfiguration (max): 2
Intel® VT-x mit Extended Page Tables (EPT): Ja
Intel® Virtualisierungstechnik für direkte I/O (VT-d): Ja
Intel® Clear Video Technologie: Nein
Grafikkarte-Familie: Matrox
PCI-Express x16-Slots: 2
Wake-on-LAN bereit: Ja
Bus Typ: QPI
Speicherkanäle, vom Prozessor unterstützt: Triple
ECC vom Prozessor unterstützt: Ja
FSB Gleichwertigkeit: Nein
Intel® My-WiFi-Technik (Intel® MWT): Nein
Intel® Anti-Theft Technologie (Intel® AT): Nein
Intel® Insider™: Nein
Intel® Flex Memory Access: Nein
Intel® Enhanced Halt State: Ja
Intel® Demand Based Switching: Ja
Intel® Clear Video Technology für Mobile Internet Devices (Intel® CVT for MID): Nein
Intel® Dual Display Capable Technology: Nein
Intel® FDI-Technik: Nein
Intel® Rapid-Storage-Technik: Nein
Intel® Fast Memory Access: Nein
CPU-Multiplikator (Bus-/Kernverhältnis): 20
Grafikkartenspeichertyp: GDDR2
Konformität mit Industriestandards: IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Tcase: 81.3 °C
Netzwerkfunktionen: Gigabit Ethernet
Maximale unterstützte Anzahl der HDD: 8
Physical Address Extension (PAE): 40 Bit
Anzahl von Stromversorgungseinheiten: 1
Unterstützung für redundantes Netzteil: Nein
Hot-Swap: Ja
Anzahl der QPI links: 2
Prozessorsystemtyp: DP
Max. Speicherkapazität: 8 TB
Disk Array Controller: LSI 1068

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