Texas Instruments MAX3238 Bedienungsanleitung

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SLLS349J − JUNE 1999 − REVISED MARCH 2004

1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DRS-232 Bus-Pin ESD Protection Exceeds

±15 kV Using Human-Body Model (HBM)

DMeets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

DOperates With 3-V to 5.5-V V

CC

Supply

DOperates Up To 250 kbit/s

DFive Drivers and Three Receivers

DLow Standby Current...1 µA Typical

DExternal Capacitors...4 × 0.1 µF

DAccepts 5-V Logic Input With 3.3-V Supply

DAlways-Active Noninverting Receiver

Output (ROUT1B)

DAlternative High-Speed Pin-Compatible

Device (1 Mbit/s)

− SNx5C3238

DApplications

− Battery-Powered Systems, PDAs,

Notebooks, Subnotebooks, Laptops,

Palmtop PCs, Hand-Held Equipment,

Modems, and Printers

description/ordering information

The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD

(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements

of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer

applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V

supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows

applications using the ring indicator to transmit data while the device is powered down. These devices operate

at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.

ORDERING INFORMATION

T

A

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SSOP (DB)

Tube of 50MAX3238CDB

MAX3238C

−0°C to 70°C

SSOP (DB)

Reel of 2000MAX3238CDBR

MAX3238C

−0°C to 70°C

TSSOP (PW)

Tube of 50MAX3238CPW

MA3238C

TSSOP (PW)

Reel of 2000MAX3238CPWR

MA3238C

SSOP (DB)

Tube of 50MAX3238IDB

MAX3238I

−40°C to 85°C

SSOP (DB)

Reel of 2000MAX3238IDBR

MAX3238I

−40°C to 85°C

TSSOP (PW)

Tube of 50MAX3238IPW

MB3238I

TSSOP (PW)

Reel of 2000MAX3238IPWR

MB3238I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Copyright  2004, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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28

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25

24

23

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21

20

19

18

17

16

15

C2+

GND

C2−

V−

DOUT1

DOUT2

DOUT3

RIN1

RIN2

DOUT4

RIN3

DOUT5

FORCEON

FORCEOFF

C1+

V+

V

CC

C1−

DIN1

DIN2

DIN3

ROUT1

ROUT2

DIN4

ROUT3

DIN5

ROUT1B

INVALID

DB OR PW PACKAGE

(TOP VIEW)

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